Method for fabricating an electronic device and a stacked electronic device

ABSTRACT

A method for fabricating an electronic device includes fixing a rear face of an integrated-circuit chip to a front face of a support wafer. An infused adhesive is applied in the form of drops or segments that are separated from each other. A protective wafer is applied to the infused adhesive, and the infused adhesive is cured. The infused adhesive includes a curable adhesive and solid spacer elements infused in the curable adhesive. A closed intermediate peripheral ring is deposited on the integrated-circuit chip outside the cured infused adhesive, and an encapsulation block is formed such that it surrounds the chip, the protective wafer and the closed intermediate peripheral ring.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.16/208,038 filed on Dec. 3, 2018, which is a divisional of U.S. patentapplication Ser. No. 15/410,230 filed on Jan. 19, 2017, now U.S. Pat.No. 10,177,098, which is a divisional of U.S. patent application Ser.No. 14/821,902 filed on Aug. 10, 2015, now U.S. Pat. No. 9,773,740,which claims the priority benefit of French Patent Application No.1461471 filed on Nov. 26, 2014, the content of each is herebyincorporated by reference in its entirety to the maximum extentallowable by law.

TECHNICAL FIELD

The present invention relates to the field of electronic devices andparticularly to electronic devices including integrated-circuit chips.

BACKGROUND

According to one known embodiment, an electronic device includes, in astacked configuration, a support wafer, an integrated-circuit chipmounted on a front face of this support wafer and including a sensor inits front face, and a protective wafer mounted above this front face.This stack is generally surrounded by an encapsulation block.

Particularly in the case in which the sensor is an optical sensorlocated on the same side as the protective wafer, selected to be made ofa transparent material, for example glass, there are attendantdifficulties for obtaining a free and leaktight space between the frontface of the chip and the protective wafer.

SUMMARY

One embodiment provides a method for fabricating at least one electronicdevice that includes a support wafer, an integrated-circuit chip, and aprotective wafer in a stacked configuration.

This method includes fixing a rear face of the chip on a front face ofthe support wafer; and depositing an infused adhesive on a zone of thefront face of the chip lying outside a central region of this frontface. The infused adhesive includes a curable adhesive and solid spacerelements that are infused in the curable adhesive. The protective waferis placed on the infused adhesive so that a free space remains betweenthe chip and the protective wafer. The curable adhesive is cured so asto fix the chip and the protective wafer together, and the depositedinfused adhesive defines at least one passage to the free space. Anencapsulation ring is produced around the chip and the protective waferand on a peripheral zone of the front face of the support wafer. Theencapsulation ring is separated from the free space by an obstructionbarrier. In one embodiment, the obstruction barrier is formed by theinfused adhesive. In another embodiment, the obstruction barrier isformed by an intermediate peripheral ring that is produced after theinfused adhesive is cured.

In one embodiment, the infused adhesive is configured in the form of anannular bead surrounding the central region and having end portionslocated at a distance from one another, so as to form the passagebetween them, this annular bead forming the obstruction barrier aftercuring the curable adhesive.

In another embodiment, the infused adhesive is configured in the form ofdrops or segments at a distance from one another. An obstruction barrieris produced in the form of an intermediate peripheral ring between thechip and the protective wafer, after curing of the adhesive of theinfused adhesive and before production of the encapsulation ring.

In order to produce the encapsulation ring a coating material issupplied, and this coating material is cured.

The curable adhesive of the infused adhesive may be a material capableof curing under the effect of heat.

The intermediate peripheral ring may be made of a material capable ofcuring under the effect of ultraviolet radiation.

One embodiment also provides an electronic device, which includes: asupport wafer having a front face; an integrated-circuit chip having arear face fixed on the front face of the support wafer; a protectivewafer located facing and at a distance from the front face of the chip.An infused adhesive is interposed between the chip and located on a zoneof the front face of the chip outside a central region of this frontface. This infused adhesive includes a curable adhesive and solid spacerelements infused in the curable adhesive. An obstruction barrier isarranged between the chip and the protective wafer, outside the centralregion of the front face of the chip, and an encapsulation ringsurrounds the chip, the protective wafer and the obstruction barrier.

The infused adhesive may be in the form of an annular bead having endportions extending at a distance from one another where this annularbead forms the obstruction barrier.

In an alternate embodiment, the infused adhesive may be in the form ofdrops or segments at a distance from one another, and the obstructionbarrier is in the form of a peripheral ring arranged between the chipand the protective wafer.

The chip may include a sensor located in the region of its front face.

The sensor may be an optical sensor and the protective wafer may betransparent.

BRIEF DESCRIPTION OF THE DRAWINGS

Electronic devices will now be described by way of non-limiting examplesillustrated by the drawings, in which:

FIG. 1 represents a cross section of an electronic device including achip and a protective wafer;

FIG. 2 represents a plan section of the electronic device along II-II ofFIG. 1, passing between the chip and the protective wafer;

FIGS. 3-5 represent cross sections of assemblies corresponding tofabrication steps of the electronic device of FIG. 1;

FIG. 6 represents a cross section of an alternative embodiment of anelectronic device including a chip and a protective wafer;

FIG. 7 represents a plan section of the electronic device along VII-VIIof FIG. 6, passing between the chip and the protective wafer; and

FIGS. 8-11 represent cross sections of assemblies corresponding tofabrication steps of the electronic device of FIG. 6.

DETAILED DESCRIPTION

As illustrated in FIGS. 1 and 2, an electronic device 1 includes asupport and electrical connection wafer 2 and an integrated-circuit chip3, a rear face 4 of which is mounted on a front face 5 of the supportwafer 2 using a thin layer of adhesive. The surface area of the, forexample square-shaped, rear face 4 is smaller than the surface area ofthe, for example square-shaped, front face 5. The chip 3 is mounted inthe middle of the support wafer 2, with the peripheral edges of the chip3 being parallel to the peripheral edges of the support wafer 2.

In the central zone of a front face 6 of the chip 3, the chip 3 includesa sensor 7, for example an optical sensor.

The support wafer 2 is provided with an electrical connection network 8.The chip 3 is connected to this electrical connection network 8 by meansof a plurality of electrical connection wires 9 which connect front pads10, which are arranged on a peripheral zone of the front face 6 of thechip 3, and front pads 11 of the electrical connection network 8, whichare arranged on a peripheral zone of the front face 5 of the supportwafer 2, between the peripheral edge of the chip 3 and the peripheraledge of the support wafer 2.

The electronic device 1 furthermore includes a protective wafer 12,which is generally transparent and which is stacked on the chip 3 andfixed at a distance from the front face 6 of the chip 3 by means of anadhesive that secures the protective wafer 12 to the chip 3. In certainembodiments, the adhesive is an infused adhesive 13, but othertechniques for securing the protective wafer 12 to the chip 3 that areknown in the art are contemplated by the present disclosure. Theperipheral edges of the protective wafer 12 extend parallel to theperipheral edges of the chip 3, inside the peripheral zone of the chip 3including the electrical connection pads 10.

The infused adhesive 13 extends between and at a distance from thesensor 7 and front pads 10 of the front face 6 of the chip 3 and on aperipheral zone of a rear face 14 of the protective wafer 12, so thatthe front face 6 of the chip 3 has a central region 15, including thesensor 7, located facing and at a distance from a central region 16 ofthe rear face 14 of the protective wafer 12 while leaving a free space 7a remaining between these regions 15 and 16.

The infused adhesive 13 includes an annular bead 17 of adhesive forminga strut, which extends in the form of an open ring surrounding thecentral region of the front face of the chip and has end portions 17 aand 17 b extending next to one another and at a distance from oneanother, while leaving a passage 18 remaining between these end portions17 a and 17 b.

The adhesive bead 17 includes solid spacer elements 19, for exampleglass or plastic beads.

The electronic device 1 furthermore includes an encapsulation ring 20made of a coating material, which extends around the peripheral edges ofthe chip 3 and of the protective wafer 12 and on the peripheral zone ofthe front face 5 of the support wafer 2, and in which the electricalconnection wires 9 are embedded.

As represented by way of example, the encapsulation ring 20 extendsbetween the chip 3 and the protective wafer 12, as far as the adhesivebead 17 and optionally between its portions 17 a and 17 b, but withoutreaching the free space 7 a. Thus, the discontinuous bead 17 secures theprotective wafer 12 to the chip 3 and constitutes an obstruction barrierfor the free space 7 a.

Thus, the free space 7 a is protected in particular from moisture andfrom any ingress of solid particles, and the sensor 7 is thereforeprotected.

According to the example represented, the encapsulation ring 20 has afront face 21 which extends in the same plane as the front face 22 ofthe protective wafer 12.

The peripheral edges of the support wafer 2 and of the encapsulationblock 20 may extend in continuation of one another, perpendicularly tothe support wafer 2, so that the electronic device 1 is in the form of aright-angled parallelepiped.

The rear face 23 of the support wafer 2 may be provided with electricalconnection elements 24 placed on rear pads of the connection network 8.

Referring to FIGS. 3-5, a way of fabricating the electronic device 1will now be described.

As illustrated in FIG. 3, with a view to collective fabrication, a panel2A is provided, which has in the form of a square matrix a plurality ofadjacent locations E, in each of which it is provided with an electricalconnection network 8.

An integrated-circuit chip 3 is put in place by transfer and fixed oneach of the locations E of the panel 2A, in the position describedabove, by means of a thin layer of adhesive.

The connection wires 9 are then put in place, as described above.

Then, for example by means of a dispensing needle, beads 17A of acurable adhesive including solid spacer elements 19 are extendedrespectively on the front faces 6 of the chips 3 which have been put inplace, along lines corresponding to the beads 17 to be produced, asdescribed above. This adhesive is a so-called thermal adhesive, that isto say it is capable of being cured under the effect of heat, by baking.It may be selected from suitable epoxy resins.

Next, as illustrated in FIG. 4, protective wafers 12 are put in placerespectively above the beads 17A, while squeezing them slightly.

By virtue of the presence of the solid spacer elements 19 in theadhesive, the existence and the thickness of the free spaces 7 a betweenthe chips 3 and the protective wafers 12 are ensured.

The adhesive beads 17A are then cured in an oven, at a suitabletemperature which is not stressful for the sensors 7, so as to obtainthe fixing beads 17.

By virtue of the existence of the passages 18 leaving communicationbetween the free spaces 7 a and the ambient environment, the gases whichare formed, in particular during polymerization of the adhesive, forexample curing the adhesive beads 17A, can escape without increasing thepressures in the free spaces 7 a.

According to an alternative embodiment, the electrical connection wires9 could be put in place after the protective wafers 12 are put in place.

Next, as illustrated in FIG. 5, a layer 20A is produced in the areaseparating the stacks of chips 3 and the protective wafers 12, on thecorresponding zones of the front face of the support panel 2A. Forexample, the layer 20A may be produced by spreading a liquid materialsuch as a suitable epoxy resin, or by injection into a mold, one face ofwhich bears on the front faces of the protective wafers 12.

This material is then cured, for example by baking in an oven, so as toform an encapsulation ring 20 as described above in each of thelocations E.

The electrical connection beads 24 are then put in place.

Lastly, the electronic devices 1 obtained in each location E are dividedup, or separated, by sawing the panel 2A and the layer 20A along theseparation lines 25 of the locations E.

As illustrated in FIGS. 6 and 7, an electronic device 100 isdistinguished from the electronic device 1, described with reference toFIGS. 1 and 2, by the fact that owing to replacement of the infusedadhesive 13, it includes a different infused adhesive 101 for themounting of the protective wafer 12 on the chip 3.

According to this exemplary embodiment, this infused adhesive 101includes a plurality of drops of adhesive 102, forming a strut,including solid spacer elements 103 and spaced apart. For example, fourpoints of adhesive 102 may be provided between opposing corner zones ofthe faces 6 and 14 of the chip 3 and of the protective wafer 12, outsideand at a distance from the central region including the sensor 7. Thedrops of adhesive are represented as being round, although they could beelongate in the form of segments.

Furthermore, an obstruction barrier is in the form of a continuousclosed intermediate peripheral ring 104 which obstructs the periphery ofthe space separating the chip 3 and the protective wafer 12. Thisintermediate peripheral ring 104 is formed on the front face 6 of thechip 3 and along the peripheral edge of the protective wafer 12.

Thus, in an equivalent way to the previous example, the free space 105formed between the faces 6 and 14 of the chip 3 and of the protectivewafer 12, and surrounded by the intermediate peripheral ring 104, isclosed and protected.

According to this embodiment, in an equivalent way to the previousexample, the electronic device 100 includes an encapsulation ring 106made of a coating material, which extends around the peripheral edges ofthe chip 3 and of the protective wafer 12, around the intermediateperipheral ring 104 and on the peripheral zone of the front face 5 ofthe support wafer 2, and in which the electrical connection wires 9 areembedded.

Referring to FIGS. 8 to 11, a way of fabricating the electronic device100 will now be described.

As illustrated in FIG. 8, with a view to collective fabrication, in anequivalent way to the previous example, a panel 2A is provided which hasin the form of a matrix a plurality of adjacent locations E, in each ofwhich locations it is provided with an electrical connection network 8.

An integrated-circuit chip 3 is fixed in the position described above oneach of the locations E of the panel 2A.

The connection wires 9 are then put in place, as described above.

Next, for example by means of a dispensing needle, drops 102A of anadhesive including solid spacer elements 103 are arranged on the frontfaces 6 of the chips 3 which have been put in place, at the positions ofthe drops 102 to be produced, as indicated above. As in the previousexample, this adhesive may be a thermal adhesive capable of being curedunder the effect of heat, for example a suitable epoxy resin.

Next, as illustrated in FIG. 9, protective wafers 12 are put in placerespectively above the drops 102A, at the locations E, while squeezingthem slightly.

By virtue of the existence of the solid spacer elements 103, theexistence and the thickness of the free spaces 105 between the chips 3and the protective wafers 12 are ensured.

The drops of adhesive 102A are then cured in an oven, at a suitabletemperature which is not stressful for the sensors 7.

By virtue of the existence of the spaces separating the drops 102A, thegases which are formed, in particular during polymerization of theadhesive, for example curing the drops of adhesive 102A, can escapewithout generating pressure in the free space 105.

Next, as illustrated in FIG. 10, for example with the aid of adispensing needle, intermediate peripheral rings 104A are formed from acoating material around the stacks, between the chips 3 and theprotective wafers 12 and at the periphery of the free spaces 105, thatis to say at the positions corresponding to the closed intermediaterings 104 to be produced, as described above. This coating material is amaterial capable of being cured under the effect of ultravioletradiation, without elevation of the temperature and without the releaseof gas. It may be a suitable epoxy resin. The rings 104A are then curedin order to form the intermediate rings 104, for example under theeffect of ultraviolet radiation.

Next, as illustrated in FIG. 11 and in an equivalent way to the previousexample with reference to FIG. 5, a layer 106A is produced in the areaseparating the stacks of chips 3 and protective wafers 12 and thecorresponding zones of the front face of the support panel 2A. Thematerial constituting this layer 106A is prevented from penetrating intothe free spaces 105 because of the existence of the closed intermediateperipheral rings 104.

This material is then cured so as to form an encapsulation block 106 ineach of the locations E.

The electrical connection beads 24 are then put in place.

Lastly, the electronic devices 100 obtained in each location E aredivided up by sawing the panel 2A and the layer 106A along the lines 107of the matrix of locations E.

According to an alternative embodiment, the support wafer 2 could bereplaced with a chip including an electronic circuit for processing thesignals coming from the chip 3.

The present invention is not limited to the examples described above. Inparticular, with the aim described above of positioning the protectivewafer at a distance from the chip provided with an optical sensor,removal of the gases appearing during curing of the bonding material andleaktight encapsulation of the space separating the chip provided withan optical sensor and the protective wafer, mounting means havingdifferent shapes and different arrangements, based on those describedabove, could be provided. Other alternative embodiments are possiblewithout departing from the scope of the invention.

1. A method of collectively fabricating a plurality of electronicdevices, comprising: forming a plurality of stacks on a support wafer,wherein forming each stack of said plurality of stacks comprises: fixinga rear face of an integrated-circuit chip on a front face of the supportwafer; depositing on a front face of the integrated-circuit chip aninfused adhesive in a plurality of drops or segments separated from eachother, the infused adhesive comprising a curable adhesive and solidspacer elements infused in the curable adhesive; placing a protectivewafer on the infused adhesive and thereby creating a free space betweenthe front face of the integrated-circuit chip and the protective wafer;curing the infused adhesive to fix the protective wafer to theintegrated-circuit chip; and depositing a closed intermediate peripheralring on the integrated-circuit chip outside of the cured infusedadhesive between the front face of the integrated-circuit chip and arear face of the protective wafer; applying an encapsulation block onthe support wafer in areas between adjacent stacks of said plurality ofstacks; and performing a dicing operation to cut through the supportwafer and the encapsulation block at locations between adjacent stacksto form a plurality of the electronic devices, wherein each electronicdevice includes at least one stack.
 2. The method of claim 1, whereincuring the infused adhesive comprises exposing the infused adhesive toheat to polymerize the infused adhesive.
 3. The method of claim 2,wherein curing the infused adhesive occurs with a release of gas.
 4. Themethod of claim 1, further comprising curing the closed intermediateperipheral ring.
 5. The method of claim 4, wherein curing the closedintermediate peripheral ring comprises exposing the closed intermediateperipheral ring to ultraviolet radiation.
 6. The method of claim 5,wherein curing of the closed intermediate peripheral ring occurs withoutreleasing gas.
 7. The method of claim 1, wherein depositing the closedintermediate peripheral ring comprises curing a resin using ultravioletradiation.
 8. The method of claim 7, wherein depositing the closedintermediate peripheral ring occurs without releasing gas.
 9. The methodof claim 1, wherein applying the encapsulation block comprises supplyinga coating material and curing the coating material.
 10. The method ofclaim 1, wherein performing the dicing operation comprises cuttingthrough the support wafer and the encapsulation block to form anencapsulating ring around said at least one stack of the electronicdevice on a peripheral zone of the front face of the diced supportwafer.